Micromac 3d microDICE
system 激光切割
Cost,
quality, and throughput are major factors of success for SiC based devices in
the semiconductor industry. 3D-Micromac answers this challenge with its
brand-new microDICE™ system.
The
revolutionary, high-performance microDICE™ laser dicing system brings
TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end.
The
microDICE™ separates wafers, including SiC, into dies with an outstanding edge
quality while increasing the yield and the throughput.
In
addition, microDICE™ considerably reduces the dicing cost per wafer. Due to the
contactless laser machining there is no tool wear and no expensive consumables
required. This results in excellent cost of ownership during the whole
life-time of the dicing system.
Compared
to traditional separation technologies microDICE™ provides a much higher
process speed and better throughput leading to high-volume production of SiC
based devices. microDICE™ is suitable to dice wafers up to 300 mm wafer size.
The
modular standard system configuration consists of:
· Cleaving funtion
· Soft scribe function
· Micro stretching function
