埋盲孔 Blind and Buried vias
Back Board
厚铜箔 Thick copper
Characteristic lmpedance
局部硬金 Selective hard gold
plating 插头镀镍金 Gold finger plating
表面塗覆Surface
finishing:
化学沉金 Chemical immersion
gold 丝印蓝胶
silkscreen peelable mask
Chemical immersion silver
热风整平 HASL
整板镀镍金(水/软金)
Flash(soft)gold over nickel 化学沉锡
Chemical immersion tin
丝印碳油 Carbon print 有机抗氧化膜 OSP
技术能力Technology
capability
层数 Layers 1-20
板材 Base material FR4
线差/线距 Conductor width/space ≥0.1mm
最大加工面稹 水金板
Max Production Panel size Gold pcb 508mmX610mm
喷锡板 HAL PCB 460mmX610mm
成品板厚 水金板
Final Board thickness Gold PCB 0.4mm-3.5mm
喷锡板 HAL PCB 0.6mm-3.5mm
翘曲度 Bow and twist 0.7%
成品孔径 Hole diameter of
final product ≥0.25mm
成品孔径公差 Hole diameter
tolerance for final product ±0.05mm
外型尺寸公差 Profile tolerance ±0.10mm
阻焊桥宽度 Width of bridge with
sololer mask ≥0.08mm
阻焊塞孔能力 Solder mask plug via
size 0.3mm-0.8mm
厚铜板 Thick copper products 3-50z
孔内铜厚度 Hole wall copper ≥20μм
